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EDGE™ low-loss modules provide an interface between the MTP® connector on an MTP trunk and the LC duplex jumpers that connect directly to the electronics. These modules feature VFL-compatible LC shuttered adapters and are manufactured with Corning® CleanAdvantage™ Technology, an innovative factory cleaning and sealing process that minimizes debris transfer and allows you to connect with confidence. 

All EDGE modules meet RoHS standards and are ideal for data center, local area network (LAN), and storage area network (SAN) applications.

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Productos

Número del producto Nombre del producto
ECM-RM12-05-93T Módulo de las soluciones EDGE™, 12 F, dúplex LC a conector MTP®, multimodo de 50 µm (OM3)
ECM-UM12-04-89G Módulo de soluciones EDGE™, 12 F, dúplex LC a conector MTP®, monomodo mejorado para curvatura (OS2)
ECM-UM12-05-93Q Módulo de las soluciones EDGE™, 12 F, dúplex LC a conector MTP®, multimodo de 50 µm (OM4)
ECM-UM12-05-93T Módulo de las soluciones EDGE™, 12 F, dúplex LC a conector MTP®, multimodo de 50 µm (OM3)
ECM-UM12-18-89G Módulo de soluciones EDGE™, 12 F, adaptador LC APC (parte frontal), adaptador MTP® APC (parte posterior), monomodo (OS2)