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J908912GEZ-NB002M

Jumper MTP® PRO de 12 Fibras  Monomodo SMF-28® Ultra (OS2), MTP (sem pinos) para MTP (com pinos), polaridade Tipo-B TIA-568, sem alça de tração, LSZH, 2 m

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General Specifications
Product Number J908912GEZ-NB002M
Flame Rating LSZH/FRNC
Fiber Category SMF-28® Ultra
Cable Type Interconnect
Standards
RoHS Free of hazardous substances according to RoHS 2011/65/EU
Condições ambientais
Faixa de temperatura, operação -10 °C  to  60 °C    (14 °F  to  140 °F    )
Design
Fiber Count 12
Outer Jacket Material LSZH/FRNC
Fiber Type SMF-28® Ultra
Mechanical Specifications
Minimum Bend Radius 35 mm
Tensile Strength 200 N
Crush Resistance 750 N/10 cm
Especificações - Conector A
Refletância, típica < -20 dB
Polida APC
Perda por inserção, máx. 0,35 dB
Nota: *IL in preconnectorized products is measured in the factory through two mated pairs.
Resistência à tração do cabo revestido 10 N
Durabilidade ≤ 0,2 dB de alteração, 200 reacoplamentos, FOTP-21
Codificado (segurança) Não
尾套颜色 黑色
连接器类型 MTP®(带导向针)
插芯材料 复合材料
配线箱颜色 黑色/绿色
配线箱材料 复合材料
尾套类型 单工
Specifications - Connector B
反射,典型的 < -20 dB
研磨 APC
插入损耗,最大 0.35 dB
备注: *IL in preconnectorized products is measured in the factory through two mated pairs.
护套缆拉伸强度 10 N
耐久性 ≤ 0.2 dB 200 插拔, FOTP-21
键控(安全) 没有
Boot Color Black
Connector Type MTP® (non-pinned)
Ferrule Material Composite
Housing Color Black / Green
Housing Material Composite
Boot Type Simplex
Reflectance ≤ -20 dB
Pulling Grip - Connector B
Tensile Strength 200 N
Dimensions
Length 2 m
Outer Diameter 2 mm
Weight 2 kg
Ordering Information
Packaging Method Cardboard box
Shipping Height 180 mm
Shipping Width 250 mm
Shipping Depth 380 mm
Units per Delivery 1/1
Slim round 2-fiber interconnect cable
Improves airflow and reduces congestion
MTP® PRO connectors
Allows for pinning and poliarity changes in the field
Bend-improved fiber
Allows tighter cable bends for slack storage and routing, less risk of downtime due to pinched or bent cables
Corning® CleanAdvantage™ technology and optimized dust cap
Eliminates the need for scoping and cleaning prior to initial field connection