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JE6E608QEZ-NA003M

Jumper MTP® PRO EDGE8®  8F, multimodo 50 µm (OM4), MTP PRO (sin pines) a MTP PRO (sin pines), LSZH, polaridad TIA-568 Tipo-A, sin ojal de tracción, 3 m

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General Specifications
Product Number JE6E608QEZ-NA003M
Flame Rating LSZH/FRNC
Fiber Category Bend-improved 50 µm MM (OM4)
Cable Assembly Type EDGE8 Jumper
Cable Type Interconnect
Assembly Insertion Loss ≤ 0.5 dB
Standards
RoHS Free of hazardous substances according to RoHS 2011/65/EU
Intermateability TIA/EIA-604-5 / TIA/EIA-604-5
Environmental Conditions
Temperature Range, Installation 0 °C  to  50 °C    (32 °F  to  122 °F    )
Temperature Range, Operation -10 °C  to  60 °C    (14 °F  to  140 °F    )
Design
Fiber Count 8
Polarity TIA-568 Type-A
Mechanical Specifications
Nominal Outer Diameter 2 mm  (0.08 in )
Max. Tensile Strength for Installation 220 N (49.46 lbf)
Min. Bend Radius Installation 30 mm (1.18 in)
Min. Bend Radius Operation 10 mm (0.39 in)
光学特性
光纤代码 T
性能选项代码 98
光纤类别 OM4 
光纤类型 多模
光纤名称 50 µm 多模 (OM4)
最大衰减 2.8 dB/km / 1.0 dB/km
波长 850 nm / 1300 nm
光纤符合性 IEC 60793-2-10
光纤纤芯直径 50 µm
包层直径 125 µm
涂层直径 242 µm
穿行1G 以太网 1000 m / 600 m
串行10 Gigabit 以太网 550 m / -
最小有效模式带宽(EMB) 4700 MHz*km / -
最小满注发射(OFL)带宽 3500 MHz*km / 500 MHz*km
Specifications - Connector A
Polish UPC
Insertion Loss, Max. 0.35 dB
Note: *IL in preconnectorized products is measured in the factory through two mated pairs.
Boot Color Black
Connector Type MTP® (non-pinned)
Ferrule Material Composite
Boot Type Individual
Reflectance < -20 dB
Specifications - Connector B
Insertion Loss, Max. 0.35 dB
Note: *IL in preconnectorized products is measured in the factory through two mated pairs.
Connector Type MTP® (non-pinned)
Ferrule Material Composite
Reflectance < -20 dB
Dimensions
Length 3 m (9.84 ft)
Cable Weight 9 kg/km (6.05 lb/1000 ft)
Ordering Information
Units per Delivery 1/1
Slim round 2-fiber interconnect cable
Improves airflow and reduces congestion
MTP® PRO connectors
Allows for pinning and poliarity changes in the field
抗弯曲光纤
允许更紧的余长存储和理线光缆弯曲,减少由于光缆被挤压和弯曲而造成的宕机风险
Corning® CleanAdvantage™ technology and optimized dust cap
Eliminates the need for scoping and cleaning prior to initial field connection