ECM-UM24-93-93Q
EDGE™ Conversion Modules 24F, MTP® (pinned) to MTP (pinned), 50 µm multimode (OM4)
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General Specifications
| Product Number | ECM-UM24-93-93Q |
| 产品类型 | 面板和模块 |
| 光纤类别 | 50 µm 多模 (OM4) |
| 应用 | 数据中心 |
Standards
| RoHS | Free of hazardous substances according to RoHS 2011/65/EU |
Environmental Conditions
| Temperature Range, Operation | -10 °C to 60 °C (14 °F to 140 °F ) |
设计
| 光纤芯数 | 24 |
| 适配器类型背面 | MTP® |
| 适配器颜色背面 | 水蓝色 |
| 适配器颜色正面 | 水蓝色 |
| 适配器类型正面 | 内置防尘盖 MTP 3x8F |
| 配线箱类型 | 面板和模块 |
| 每个面板适配器数量 | 3 |
光缆设计
| 极性 | TIA-568 Type-B |
光学规格 - 硬件
| Module Insertion Loss, Max | 0.5 dB |
| 波长 | 850 nm / 1300 nm |
| 光纤类别 | 50 µm 多模 (OM4) |
Specifications - Connector A
| Connector Type | MTP® (pinned) |
| Ferrule Material | Composite |
Specifications - Connector B
| Connector Type | MTP® (pinned) |
| Ferrule Material | Composite |
Dimensions
| Height | 12 mm |
| Width | 90 mm |
| Depth | 144.3 mm |
| Weight | 11 kg |
Ordering Information
| Units per Delivery | 1/1 |
VFL-compatible shuttered LC adapters
Creates one-hand operation and decreases time needed to test and troubleshoot a link
Rear-loading capability
Decreases the time to prepare and install modules into fiber housings
High density
Module enables 576 fibers in a 4U housing and 144 fibers in a 1U
Low insertion loss performance
Improved performance specs allow for more mated pairs and/or longer link distances
Corning® CleanAdvantage™ technology and optimized dust cap
Eliminates the need for scoping and cleaning prior to initial field connection