DMA4F1FDD1NC050M0P
Evolv® Terminal with Pushlok® Technology 4 port, stubbed, SST Dielectric, 50 m
通用规范
| 产品编码 | DMA4F1FDD1NC050M0P |
| 产品类型 | 终端 |
| 环境 | 室外 |
| 光缆类型 | SST 扁平绝缘落线 |
| 光纤类别 | ITU-TG.652.D (OS2) |
| 包装 | 单个包装 |
| 预端接硬件 | 没有 |
| 可锁 | 无 |
| 光缆类型端接的 | SST落线光缆 |
| 安装类型 | Strand mount, 抱杆, 基座安装, Handhole Mount |
| 熔接选项 | 没有 |
| 应用 | FTTx |
| 技术 | Pushlok® |
标准
| RoHS | 无有害物质根据RoHS 2011/65/EU |
| 设计和测试标准 | IP68 |
环境条件
| 温度范围，操作 | -40 °C - 85 °C (-40 °F - 185 °F ) |
| 温度范围，存储 | -40 °C - 85 °C (-40 °F - 185 °F ) |
设计
| 光纤芯数 | 4 |
| 输入芯数 | 4 |
| 光纤配色 | 蓝色, 橙色, 绿色, 棕色 |
| 芯数/端口 | 1 |
| 单芯端口数，SC APC连接器 | 4 |
| 配线箱材料 | 塑料 |
| Pigtail Length | 50 m |
| 输入缆类型 | SST 扁平绝缘落线 |
| 锁可用性 | 无 |
| 密封类型 | Welded |
| 配线箱颜色 | 黑色 |
| 尾纤类型 | 绝缘 |
| 输入光缆的光纤芯数 | 4 |
| 端口数 | 4 |
设计 - 适配器
| 适配器类型 | Pushlok® |
机械特性
| 冷插拔 | -40 °C (-40 °F) |
| Cable Length | 50 m |
光学规格 - 硬件
| Module Insertion Loss, Max | 0.5 dB |
| 反射，最大 | 65 dB |
Connector Specs
| 研磨 | APC |
| 配线箱颜色 | 黑色 |
| 配线箱材料 | 塑料 |
Specifications - Connector A
| 连接器类型 | Pushlok® |
| 配线箱颜色 | 黑色 |
| 研磨 | APC |
| 配线箱材料 | 塑料 |
| 端面类型 | APC |
| 插入损耗，最大 | 0.5 dB |
| 反射 | > 65 dB |
| 插入损耗，典型 | ≤ 0.15 dB |
尺寸
| 高度 | 30 mm |
| 宽度 | 84 mm |
| 深度 | 152 mm |
| Weight | 2.5 kg |
订购信息
| 包装方法 | 盒 |
| Shipping Weight | 2.8 kg |
| 每次交付的单元数 | 1/1 |
| Shipping Height | 762 mm |
| Shipping Width | 762 mm |
| Shipping Depth | 152 mm |
Pushlok™ cable assembly connector ports for customer drop terminations
Lower installation cost and increased speed of connection
Standard and integrated splitter terminal options Durability
Solution supports various architecture types
Durability
100 lb cable tensile strength
Available stubbed or preterminated with OptiTip® multifiber connector technology
Compatible with existing FlexNAP™ installations
Small form factor optimizes space in pedestals/handholes
Lower profile overall with drop entry ports on bottom
Ultrasonically welded housing
Eliminates water ingress potential and prevents unwanted entry in the field
Factory-terminated polished connectors
Eliminates loss associated with excess fusion splices