J939312QEZ-NA003M
12-Fiber MTP® PRO Jumper 50 µm multimode (OM4), MTP to MTP, TIA-568 Type-A polarity, no pulling grip, LSZH, 3 m
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General Specifications
| Product Number | J939312QEZ-NA003M |
| 阻燃等级 | LSZH™/FRNC |
| 光纤类别 | 50 µm 多模 (OM4) |
| 光缆类型 | 互联 |
| 拉手 | 无 |
标准
| RoHS | 无有害物质根据RoHS 2011/65/EU |
环境条件
| 温度范围，操作 | -10 °C to 60 °C (14 °F to 140 °F ) |
设计
| 光纤芯数 | 12 |
| 外护套材料 | LSZH™/FRNC |
| 极性 | 经典 |
| 光纤类型 | 多模 |
机械特性
| 标称外径 | 2 mm |
| 最大安装拉伸强度 | 200 N |
| 最小安装弯曲半径 | 30 mm |
| 最小操作弯曲半径 | 10 mm |
Optical Characteristics
| Fiber Code | T |
| Performance Option Code | 98 |
| Fiber Category | OM4 |
| Fiber Type | Multimode |
| Fiber Name | 50 µm MM (OM4) |
| Maximum Attenuation | 2.8 dB/km / 1.0 dB/km |
| Wavelengths | 850 nm / 1300 nm |
| Fiber Compliance | IEC 60793-2-10 |
| Fiber Core Diameter | 50 µm |
| Cladding diameter | 125 µm |
| Coating diameter | 242 µm |
| Serial 1 Gigabit Ethernet | 1000 m / 600 m |
| Serial 10 Gigabit Ethernet | 550 m / - |
| Minimum Effective Modal Bandwidth (EMB) | 4700 MHz*km / - |
| Min. Overfilled Launch (OFL) Bandwidth | 3500 MHz*km / 500 MHz*km |
Specifications - Connector A
| 反射，典型的 | < -20 dB |
| 研磨 | PC |
| 插入损耗，最大 | 0.35 dB |
| 备注： | *IL in preconnectorized products is measured in the factory through two mated pairs. |
| 键控（安全） | 没有 |
| 尾套颜色 | 水蓝色 |
| 连接器类型 | MTP®（带导向针） |
| 插芯材料 | 复合材料 |
| 配线箱颜色 | 黑色 |
| 配线箱材料 | 复合材料 |
| 尾套类型 | 单个 |
Specifications - Connector B
| 反射，典型的 | < -20 dB |
| 研磨 | PC |
| 插入损耗，最大 | 0.35 dB |
| 备注： | *IL in preconnectorized products is measured in the factory through two mated pairs. |
| 尾套颜色 | 水蓝色 |
| 连接器类型 | MTP®（带导向针） |
| 插芯材料 | 复合材料 |
| 配线箱颜色 | 黑色 |
| 配线箱材料 | 复合材料 |
| 尾套类型 | 单个 |
拉环 - 连接器 A
| 拉手 | 无 |
尺寸
| 长度 | 3 m |
| Cable Weight | 10 kg/km |
订购信息
| 每次交付的单元数 | 1/1 |
Slim round 2-fiber interconnect cable
Improves airflow and reduces congestion
MTP® PRO connectors
Allows for pinning and poliarity changes in the field
Bend-improved fiber
Allows tighter cable bends for slack storage and routing, less risk of downtime due to pinched or bent cables
Corning® CleanAdvantage™ technology and optimized dust cap
Eliminates the need for scoping and cleaning prior to initial field connection