

JE8E808GEZ-NB003M
EDGE8™ MTP® PRO Jumper 8F, Bend-improved Single-mode (OS2), MTP (non-pinned) to MTP (non-pinned), LSZH, TIA-568 Type-B polarity, no pulling grip, 3 m
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General Specifications
Product Number | JE8E808GEZ-NB003M |
EAN Code | 4056418104126 |
阻燃等级 | LSZH™/FRNC |
光纤类别 | 抗弯曲单模(OS2) |
光缆组件类型 | EDGE8™ MTP®跳线 |
光缆类型 | 互联 |
组件插入损耗 | ≤ 0.5 dB |
标准
RoHS | 无有害物质根据RoHS 2011/65/EU |
互操作性 | TIA/EIA-604-5 / TIA/EIA-604-5 |
环境条件
温度范围,安装 | 0 °C to 50 °C (32 °F ) |
温度范围,操作 | -10 °C to 60 °C |
设计
光纤芯数 | 8 |
极性 | TIA-568 类型B |
机械特性
标称外径 | 2 mm |
最大安装拉伸强度 | 220 N |
最小安装弯曲半径 | 30 mm |
最小操作弯曲半径 | 10 mm |
Optical Characteristics
Fibre code | Z |
Performance option code | 20 |
Fibre category | OS2 |
Fibre Type | Single-mode (OS2) / 250 µm |
Fibre name | Bend-Improved Single-mode (OS2) |
Maximum Attenuation | 0.34 dB/km / 0.34 dB/km / 0.20 dB/km |
Wavelengths | 1310 nm / 1383 nm / 1550 nm |
Fibre compliance | ITU-T G.652.D and ITU-T G.657.A1 |
Fibre core diameter | 8.2 µm |
Cladding diameter | 125 µm |
Coating diameter | 242 µm |
Dispersion @ 1550 nm | ≤ 18 [ps/(nm*km)] |
Dispersion @ 1625 nm | ≤ 22 [ps/(nm*km)] |
Cable cutoff wavelength | 1260 nm |
Mode-Field Diameter at 1310 nm | 9.2 µm |
Mode-Field Diameter at 1550 nm | 10.4 µm |
PMD Link Design Value | ≤ 0.04 ps/√km |
PMD (Polarization Mode Dispersion) maximum individual fibre | ≤ 0.1 ps/√km |
Specifications - Connector A
研磨 | APC |
插入损耗,最大 | 0.35 dB |
备注: | *IL in preconnectorized products is measured in the factory through two mated pairs. |
尾套颜色 | 黑色 |
连接器类型 | MTP®(不带导向针) |
插芯材料 | 复合材料 |
尾套类型 | 单个 |
反射 | < -20 dB |
Specifications - Connector B
插入损耗,最大 | 0.35 dB |
备注: | *IL in preconnectorized products is measured in the factory through two mated pairs. |
连接器类型 | MTP®(不带导向针) |
插芯材料 | 复合材料 |
反射 | < -20 dB |
尺寸
长度 | 3 m |
Cable Weight | 9 kg/km |
订购信息
每次交付的单元数 | 1/1 |
Slim round 2-fiber interconnect cable
Improves airflow and reduces congestion
MTP® PRO connectors
Allows for pinning and poliarity changes in the field
Bend-improved fibre
Allows tighter cable bends for slack storage and routing, less risk of downtime due to pinched or bent cables
Corning® CleanAdvantage™ technology and optimised dust cap
Eliminates the need for scoping and cleaning prior to initial field connection