DSF8F100D1NC000S0P
Evolv® Splitter Terminal with Pushlok® Technology 8 port, unstubbed, 1x8 splitter
General Specifications
| Product Number | DSF8F100D1NC000S0P |
| 产品类型 | 终端 |
| 环境 | 室外 |
| 光纤类别 | ITU-TG.652.D (OS2) |
| 包装 | 单个包装 |
| 预端接硬件 | 是 |
| Lockable | No |
| Mounting Type | Strand mount, Pole-mount, Pedestal mount, Handhole Mount |
| Splice option | Yes |
| Application | FTTx |
| Technology | Pushlok® |
Standards
| RoHS | Free of hazardous substances according to RoHS 2011/65/EU |
| Design and Test Criteria | IP68 |
Environmental Conditions
| Temperature Range, Operation | -40 °C to 85 °C (-40 °F to 185 °F ) |
| Temperature Range, Storage | -40 °C to 85 °C (-40 °F to 185 °F ) |
设计
| 输入芯数 | 1 |
| 光纤配色 | 蓝色, 橙色, 绿色, 棕色, 石板色, 白色, 红色, 黑色 |
| 芯数/端口 | 1 |
| 单芯端口数，SC APC连接器 | 8 |
| 配线箱材料 | 塑料 |
| 锁可用性 | 无 |
| 密封类型 | Welded |
| 配线箱颜色 | 黑色 |
| 光纤容量 | 8 |
| 输入光缆的光纤芯数 | 8 |
| 端口数 | 8 |
设计 - 适配器
| 适配器类型 | Pushlok® |
Mechanical Specifications
| Cold Mate/Demate | -40 °C (-40 °F) |
Optical Specification - Hardware
| Module Insertion Loss, Max | 11.4 dB |
Connector Specs
| Polish | APC |
| Housing Color | Black |
| Housing Material | Plastic |
Specifications - Connector A
| Connector Type | Pushlok® |
| Housing Color | Black |
| Polish | APC |
| Housing Material | Plastic |
| Endface Type | APC |
| Reflectance | > 65 dB |
| Insertion Loss, Typical | ≤ 0.15 dB |
Specifications - Connector B
| Connector Type | Pushlok® |
Dimensions
| Height | 30 mm |
| Width | 136 mm |
| Depth | 31 mm |
| Weight | 0.35 kg |
Ordering Information
| Packaging Method | Box |
| Shipping Weight | 0.35 kg |
| Units per Delivery | 1/1 |
| Shipping Height | 206 mm |
| Shipping Width | 31 mm |
| Shipping Depth | 136 mm |
Pushlok™ cable assembly connector ports for customer drop terminations
Lower installation cost and increased speed of connection
Standard and integrated splitter terminal options Durability
Solution supports various architecture types
Durability
100 lb cable tensile strength
Available stubbed or preterminated with OptiTip® multifiber connector technology
Compatible with existing FlexNAP™ installations
Small form factor optimizes space in pedestals/handholes
Lower profile overall with drop entry ports on bottom
Ultrasonically welded housing
Eliminates water ingress potential and prevents unwanted entry in the field
Factory-terminated polished connectors
Eliminates loss associated with excess fusion splices