JE9E908QEZ-NA003M
EDGE8™ MTP® PRO Jumper 8F, 50 µm multimode (OM4), MTP PRO X (non-pinned) to MTP PRO X (non-pinned), LSZH, TIA-568 Type-A polarity, no pulling grip, 3 M
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General Specifications
| Product Number | JE9E908QEZ-NA003M |
| Flame Rating | LSZH/FRNC |
| Fiber Category | 50 µm MM (OM4) |
| Cable Assembly Type | EDGE8 Jumper |
| Environment | Indoor |
| Cable Type | Interconnect |
| Assembly Insertion Loss | ≤ 0.35 dB |
Standards
| RoHS | Free of hazardous substances according to RoHS 2011/65/EU |
| Intermateability | TIA/EIA-604-5 / TIA/EIA-604-5 |
环境条件
| 温度范围，安装 | 0 °C to 50 °C (32 °F to 122 °F ) |
| 温度范围，操作 | -10 °C to 60 °C (14 °F to 140 °F ) |
| 温度范围，存储 | -25 °C to 70 °C (-13 °F to 158 °F ) |
设计
| 光纤芯数 | 8 |
| 极性 | TIA-568 类型-A |
| 光纤类型 | 多模 |
机械特性
| 最小弯曲半径 | 17 mm |
| 标称外径 | 2 mm |
| 最大安装拉伸强度 | 220 N |
| 抗压 | 350 N/10 cm |
| 最小安装弯曲半径 | 30 mm |
| 最小操作弯曲半径 | 10 mm |
Specifications - Connector A
| 研磨 | APC |
| 插入损耗，最大 | 0.35 dB |
| 备注： | *IL in preconnectorized products is measured in the factory through two mated pairs. |
| 护套缆拉伸强度 | 40 N |
| 耐久性 | ≤ 0.2 dB 200 插拔, FOTP-21 |
| 尾套颜色 | 黑色 |
| 连接器类型 | MTP PRO X® (non-pinned) |
| 插芯材料 | 复合材料 |
| 尾套类型 | 单个 |
| 反射 | < -45 dB |
Specifications - Connector B
| 研磨 | APC |
| 插入损耗，最大 | 0.35 dB |
| 备注： | *IL in preconnectorized products is measured in the factory through two mated pairs. |
| 护套缆拉伸强度 | 40 N |
| 耐久性 | ≤ 0.2 dB 200 插拔, FOTP-21 |
| 尾套颜色 | 黑色 |
| 连接器类型 | MTP PRO X® (non-pinned) |
| 插芯材料 | 复合材料 |
| 尾套类型 | 单个 |
| 反射 | < -20 dB |
尺寸
| 长度 | 3 m |
| Cable Weight | 9 kg/km |
Ordering Information
| Packaging Method | Cardboard box |
| Units per Delivery | 1/1 |
| Shipping Height | 180 mm |
| Shipping Width | 250 mm |
| Shipping Depth | 380 mm |
Slim round 2-fiber interconnect cable
Improves airflow and reduces congestion
MTP® PRO connectors
Allows for pinning and poliarity changes in the field
Bend-improved fiber
Allows tighter cable bends for slack storage and routing, less risk of downtime due to pinched or bent cables
Corning® CleanAdvantage™ technology and optimized dust cap
Eliminates the need for scoping and cleaning prior to initial field connection