ECM8-04E8-GEZB-003M
EDGE8® Port Breakout Module 8F, LC Duplex to 3 m LSZH™/FRNC Interconnect MTP® (non-pinned), Bend-improved single-mode (OS2), Type B
You might also be interested in
General Specifications
| Product Number | ECM8-04E8-GEZB-003M |
| Product Type | Panels and Modules |
| Cable Type | Interconnect |
| Application | Data Center |
General Specifications
| Product Type | Panels and Modules |
| Cable Type | Interconnect |
| Application | Data Center |
Standards
| RoHS | Free of hazardous substances according to RoHS 2011/65/EU |
Design
| Adapter Type Front | Shuttered LC |
| Housing Type | Panels and Modules |
| Panel or Module Type | EDGE8 |
Cable Design
| Polarity | Universal, TIA-568 Type-B |
Optical Specification - Hardware
| Module Insertion Loss, Max | 0.6 dB |
| Wavelengths | 1310 nm / 1550 nm |
Specifications - Connector A
| Connector Type | LC Uniboot |
| Ferrule Material | Ceramic |
Specifications - Connector B
| Connector Type | LC Uniboot |
| Ferrule Material | Ceramic |
Dimensions
| Weight | 45 kg |
Ordering Information
| Package Contents | Port Breakout Modules packaged in individual plastic bags |
| Units per Delivery | 1/1 |
VFL-compatible shuttered LC adapters
Creates one-hand operation and decreases time needed to test and troubleshoot a link
Rear-loading capability
Decreases the time to prepare and install modules into fiber housings
High density
Module enables 576 fibers in a 4U housing and 144 fibers in a 1U
Low insertion loss performance
Improved performance specs allow for more mated pairs and/or longer link distances
Corning® CleanAdvantage™ technology and optimized dust cap
Eliminates the need for scoping and cleaning prior to initial field connection