EDGE™ Module
EDGE™ low-loss modules provide an interface between the MTP® connector on an MTP trunk and the LC duplex jumpers that connect directly to the electronics. These modules feature VFL-compatible LC shuttered adapters and are manufactured with Corning® CleanAdvantage™ Technology, an innovative factory cleaning and sealing process that minimizes debris transfer and allows you to connect with confidence.
All EDGE modules meet RoHS standards and are ideal for data center, local area network (LAN), and storage area network (SAN) applications.
光纤类型
包装方式
Individual Blister Pack
极性
研磨A
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Products
| Product Number | Product Name | |
|---|---|---|
| ECM-RM12-05-93T | Módulo EDGE™, 12F, Multimodo 50 µm (OM3), Polaridad Directa | |
| ECM-UM12-04-89G | Módulo EDGE™, 12F, Monomodo (OS2), Polaridad Universal | |
| ECM-UM12-05-93Q | EDGE™ MTP® to LC Duplex Module, 12F, 5µm Multimode (OM4) | |
| ECM-UM12-05-93T | Módulo EDGE™, 12F, Multimodo 50 µm (OM3), Polaridad Universal | |
| ECM-UM12-18-89G | EDGE™ MTP to LC Duplex Module, 12F, Bend-improved Single-mode (OS2), LC Duplex APC, Universal Polarity |