EDGE™ Module
EDGE™ low-loss modules provide an interface between the MTP® connector on an MTP trunk and the LC duplex jumpers that connect directly to the electronics. These modules feature VFL-compatible LC shuttered adapters and are manufactured with Corning® CleanAdvantage™ Technology, an innovative factory cleaning and sealing process that minimizes debris transfer and allows you to connect with confidence.
All EDGE modules meet RoHS standards and are ideal for data center, local area network (LAN), and storage area network (SAN) applications.
Fiber Category
Packaging Method
Individual Blister Pack
Polish B
Polarity
You might also be interested in
Products
| Product Number | Product Name | |
|---|---|---|
| ECM-RM12-05-93T | EDGE™ MTP to LC Duplex Module, 12F, 50 µm multimode (OM3), Straight-Through Polarity | |
| ECM-UM12-04-89G | EDGE™ MTP® to LC Duplex Module, 12 F, single-mode (OS2) | |
| ECM-UM12-05-93Q | EDGE™ MTP® to LC Duplex Module, 12 F, 5µm Multimode (OM4) | |
| ECM-UM12-05-93T | EDGE™ MTP® to LC Duplex Module, 12 F, 5µm Multimode (OM3) | |
| ECM-UM12-18-89G | EDGE™ MTP to LC Duplex Module, 12F, Bend-improved Single-mode (OS2), LC Duplex APC, Universal Polarity |