

00D101JFDT3020M
Evolv® DualDrop™ Assembly with Pushlok® Technology Pushlok® Technology Pushlok Pigtail, 20 m, bulk packaging
Spécifications générales
Référence du produit | 00D101JFDT3020M |
阻燃等级 | LSZH™/FRNC |
光纤类别 | ClearCurve® LBL |
光缆组件类型 | 落线组件 |
环境 | 室内/室外 |
应用 | FTTH |
拉手数 | 0 |
光缆类型 | Dualdrop Indoor/Outdoor Dielectric |
组件插入损耗 | ≤ 0.15 dB |
Connector Assembly Type | Pigtail to Pushlok |
包装 | 散装包装 |
预端接硬件 | 是 |
Normes
RoHS | Ne contient aucune substance dangereuse au sens de la directive RoHS 2011/65/EU |
设计
光纤芯数 | 1 |
外护套颜色 | 黑色 |
光纤类型 | 单模 |
机械特性
冷插拔 | 50 °C (122 °F) |
轴向拉伸,接头到缆,通过防尘盖 | 444.82 N (100 磅) 轴向拉力, 并将负载施加到防尘盖上 |
Optical Characteristics
Fiber Code | J |
Performance Option Code | 25 |
Fiber Category | OS2 |
Fiber Type | Single-mode (OS2) / 250 µm |
Fiber Name | ClearCurve® LBL |
Maximum Attenuation | 0.38 dB/km / 0.38 dB/km / 0.25 dB/km |
Wavelengths | 1310 nm / 1383 nm / 1550 nm |
Fiber Compliance | ITU-T G.652.D and ITU-T G.657.A2/B2 |
Fiber Core Diameter | 8.2 µm |
Cladding diameter | 125 µm |
Coating diameter | 242 µm |
Dispersion @ 1550 nm | ≤ 18 [ps/(nm*km)] |
Dispersion @ 1625 nm | ≤ 23 [ps/(nm*km)] |
Fiber Bend Performance at 1550nm 7.5mm radius | ≤ 0.4 dB/turn |
Cable cutoff wavelength | 1260 nm |
Mode-Field Diameter at 1310 nm | 8.6 µm |
Mode-Field Diameter at 1550 nm | 9.6 µm |
PMD Link Design Value | ≤ 0.06 ps/√km |
PMD maximum individual fiber | ≤ 0.2 ps/√km |
Parallel Optics 40 Gigabit Ethernet | 150 m / - |
Specifications - Connector A
连接器类型 | 尾纤 |
Specifications - Connector B
反射,典型的 | > 65 dB |
插入损耗,典型 | ≤ 0.15 dB |
插入损耗,最大 | 0.3 dB |
连接器类型 | Pushlok® |
插芯材料 | 氧化锆 |
尺寸
长度 | 20 m |
Informations pour commander
Méthode d'emballage | Emballage en vrac |
Hardened connector technology
Reduced-diameter Pushlok™ connector
ClearCurve Single-mode Fiber
Enables installers to route the subunit around tight corners down to 5 mm radius inside the home to reduce the cost and the time of drop cable deployment in optical access networks
Versatile installation environments
This dielectric cable eliminates any bonding and grounding requirements and is suitable for aerial, facade, direct buried and duct installation
Compact, robust design
Meets industry standards and eliminates installation complexity