ECM8-05E6-QEZA-003M
EDGE8™ 集成光缆模块 8F, LC Duplex to 3 m LSZH™/FRNC Interconnect MTP® (non-pinned), 50 µm multimode (OM4), Type A
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General Specifications
| Product Number | ECM8-05E6-QEZA-003M |
| 产品类型 | 面板和模块 |
| 光缆类型 | 互联 |
| 应用 | 数据中心 |
标准
| RoHS | 无有害物质根据RoHS 2011/65/EU |
设计
| 适配器类型正面 | 内置防尘盖LC |
| 配线箱类型 | EDGE™ |
| 面板或模块类型 | EDGE8™ |
光缆设计
| 极性 | 通用，TIA-568类型A |
光学规格 - 硬件
| Module Insertion Loss, Max | 0.35 dB |
| 波长 | 850 nm / 1300 nm |
Specifications - Connector A
| 连接器类型 | LC集成尾套 |
| 插芯材料 | 陶瓷 |
Specifications - Connector B
| 连接器类型 | LC集成尾套 |
| 插芯材料 | 陶瓷 |
订购信息
| 包装内容物 | Port Breakout Modules packaged in individual plastic bags |
| 每次交付的单元数 | 1/1 |
VFL-compatible shuttered LC adapters
Creates one-hand operation and decreases time needed to test and troubleshoot a link
Rear-loading capability
Decreases the time to prepare and install modules into fiber housings
High density
Module enables 576 fibers in a 4U housing and 144 fibers in a 1U
Low insertion loss performance
Improved performance specs allow for more mated pairs and/or longer link distances
Corning® CleanAdvantage™ technology and optimized dust cap
Eliminates the need for scoping and cleaning prior to initial field connection