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EDGE™ Module
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EDGE™ low-loss modules provide an interface between the MTP® connector on an MTP trunk and the LC duplex jumpers that connect directly to the electronics. These modules feature VFL-compatible LC shuttered adapters and are manufactured with Corning® CleanAdvantage™ Technology, an innovative factory cleaning and sealing process that minimizes debris transfer and allows you to connect with confidence.
All EDGE modules meet RoHS standards and are ideal for data center, local area network (LAN), and storage area network (SAN) applications.
光纤类型
包装方式
Individual Blister Pack
研磨B
极性
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Produtos
Número do produto | Nome do produto | |
---|---|---|
ECM-RM12-05-93T | EDGE™ MTP to LC Duplex Module, 12F, 50 µm multimode (OM3), Straight-Through Polarity | |
ECM-UM12-04-89G | EDGE™ 解决方案模块,12 芯,LC 双工到 MTP® 连接器,抗弯曲单模 (OS2) | |
ECM-UM12-05-93Q | EDGE™ MTP® to LC Duplex Module, 12 F, 5µm Multimode (OM4) | |
ECM-UM12-05-93T | EDGE™ MTP® to LC Duplex Module, 12 F, 5µm Multimode (OM3) | |
ECM-UM12-18-89G | EDGE™ MTP to LC Duplex Module, 12F, Bend-improved Single-mode (OS2), LC Duplex APC, Universal Polarity |