EDGE™ Solutions Module
EDGE™ low-loss modules provide an interface between the MTP® connector on an MTP trunk and the LC duplex jumpers that connect directly to the electronics. These modules feature VFL-compatible LC shuttered adapters and are manufactured with Corning® CleanAdvantage™ Technology, an innovative factory cleaning and sealing process that minimizes debris transfer and allows you to connect with confidence.
All EDGE modules meet RoHS standards and are ideal for data center, local area network (LAN), and storage area network (SAN) applications.
Fibre Category
Packaging Method
Individual Blister Pack
Polarity
Polish A
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Products
| Product Number | Product Name | |
|---|---|---|
| ECM-RM12-05-93Q | EDGE™ Solutions Module | |
| ECM-RM12-05-93T | EDGE™ Solutions Module, 12 F, LC Duplex to MTP® Connector, OM3 | |
| ECM-UM12-04-89G | EDGE™ MTP® to LC Duplex Module, 12 F, single-mode (OS2) | |
| ECM-UM12-05-75TI | EDGE™ Solutions Module, 12 F, LC Duplex to MTP® Connector, OM3 | |
| ECM-UM12-05-93Q | EDGE™ MTP® to LC Duplex Module, 12 F, 5µm Multimode (OM4) | |
| ECM-UM12-05-93Q-VI | EDGE™ Module, 12 F, LC Duplex to MTP® Connector, 50 µm multimode (OM4) | |
| ECM-UM12-05-93T | EDGE™ MTP® to LC Duplex Module, 12 F, 5µm Multimode (OM3) | |
| ECM-UM12-05-93TI | EDGE™ Solutions Module, 12 F, LC Duplex to MTP® Connector, OM3 | |
| ECM-UM12-18-89G | EDGE™ Solutions Module, 12 F, LC APC to MTP® APC Connector, OS2 |