EDGE™ Module
EDGE™ low-loss modules provide an interface between the MTP® connector on an MTP trunk and the LC duplex jumpers that connect directly to the electronics. These modules feature VFL-compatible LC shuttered adapters and are manufactured with Corning® CleanAdvantage™ Technology, an innovative factory cleaning and sealing process that minimizes debris transfer and allows you to connect with confidence.
All EDGE modules meet RoHS standards and are ideal for data center, local area network (LAN), and storage area network (SAN) applications.
Catégorie de fibre
Emballage
Individual Blister Pack
Polarité
Universal
Polish A
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Productos
| Número del producto | Nombre del producto | |
|---|---|---|
| ECM-UM12-04-89G | edge-module, 12 FO, connecteur LC Duplex vers MTP®, monomode (OS2) avec meilleure tolérance aux courbures | |
| ECM-UM12-05-93T | edge-module, 12 FO, 50 µm multimode (OM3) | |
| ECM-UM12-05-93Q | edge-module, 12 FO, 50 µm multimode (OM4) |