EDGE™ Module
EDGE™ low-loss modules provide an interface between the MTP® connector on an MTP trunk and the LC duplex jumpers that connect directly to the electronics. These modules feature VFL-compatible LC shuttered adapters and are manufactured with Corning® CleanAdvantage™ Technology, an innovative factory cleaning and sealing process that minimizes debris transfer and allows you to connect with confidence.
All EDGE modules meet RoHS standards and are ideal for data center, local area network (LAN), and storage area network (SAN) applications.
Fiber Category
Packaging Method
Polarity
Polish A
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Products
| Product Number | Product Name | |
|---|---|---|
| ECM-RM12-04-89G | Módulo EDGE™ | |
| ECM-RM12-05-93Q | Módulo EDGE™ | |
| ECM-RM12-05-93T | EDGE™ MTP to LC Duplex Module, 12F, 50 µm multimode (OM3), Straight-Through Polarity | |
| ECM-RM12-18-89G | Módulo EDGE™ | |
| ECM-UM12-04-89G | EDGE™ MTP® to LC Duplex Module, 12F, single-mode (OS2) | |
| ECM-UM12-04-89G-Z | Módulo EDGE™ | |
| ECM-UM12-05-93Q | Módulo EDGE™, 12F, Multimodo 50 µm (OM4), Polaridad Universal | |
| ECM-UM12-05-93Q-VI | Módulo EDGE™ | |
| ECM-UM12-05-93Q-Z | Módulo EDGE™ | |
| ECM-UM12-05-93T | Módulo EDGE™, 12F, Multimodo 50 µm (OM3), Polaridade Universal | |
| ECM-UM12-18-89G | Módulo EDGE™, 12F, Monomodo (OS2), Polaridade Universal |