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EDGE™ Solutions Modul
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EDGE™ low-loss modules provide an interface between the MTP® connector on an MTP trunk and the LC duplex jumpers that connect directly to the electronics. These modules feature VFL-compatible LC shuttered adapters and are manufactured with Corning® CleanAdvantage™ Technology, an innovative factory cleaning and sealing process that minimizes debris transfer and allows you to connect with confidence.
All EDGE modules meet RoHS standards and are ideal for data center, local area network (LAN), and storage area network (SAN) applications.
Faserkategorie
Verpackung
Individual Blister Pack
Polnisch B
Polarität
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Produkte
Produktnummer | Produktname | |
---|---|---|
ECM-RM12-05-93Q | EDGE™ Solutions Modul | |
ECM-RM12-05-93T | EDGE™ Lösung Modul, 12 F, LC Duplex auf MTP® Stecker, OM3 | |
ECM-UM12-04-89G | EDGE™ MTP® zu LC Duplex Modul, 12 F, Sultimode (OS2) | |
ECM-UM12-05-75TI | EDGE™ Lösung Modul, 12 F, LC Duplex auf MTP® Stecker, OM3 | |
ECM-UM12-05-93Q | EDGE™ MTP® zu LC Duplex Modul, 12 F, 50 µm Multimode (OM4) | |
ECM-UM12-05-93Q-VI | EDGE™ Lösung Modul, 12 F, LC Duplex auf MTP® Stecker, OM4 | |
ECM-UM12-05-93T | EDGE™ MTP® zu LC Duplex Modul, 12 F, 50 µm Multimode (OM3) | |
ECM-UM12-05-93TI | EDGE™ Lösung Modul, 12 F, LC Duplex auf MTP® Stecker, OM3 | |
ECM-UM12-18-89G | EDGE™ Lösung Modul, 12 F, LC APC auf MTP® APC Stecker, OS2 |