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EDGE™ Solutions Modul

EDGE™ low-loss modules provide an interface between the MTP® connector on an MTP trunk and the LC duplex jumpers that connect directly to the electronics. These modules feature VFL-compatible LC shuttered adapters and are manufactured with Corning® CleanAdvantage™ Technology, an innovative factory cleaning and sealing process that minimizes debris transfer and allows you to connect with confidence.
All EDGE modules meet RoHS standards and are ideal for data center, local area network (LAN), and storage area network (SAN) applications.

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Produkte

Produktnummer Produktname
ECM-RM12-05-93Q EDGE™ Solutions Modul
ECM-RM12-05-93T EDGE™ Lösung Modul, 12 F, LC Duplex auf MTP® Stecker, OM3
ECM-UM12-04-89G EDGE™ MTP® zu LC Duplex Modul, 12 F, Sultimode (OS2)
ECM-UM12-05-75TI EDGE™ Lösung Modul, 12 F, LC Duplex auf MTP® Stecker, OM3
ECM-UM12-05-93Q EDGE™ MTP® zu LC Duplex Modul, 12 F, 50 µm Multimode (OM4)
ECM-UM12-05-93Q-VI EDGE™ Lösung Modul, 12 F, LC Duplex auf MTP® Stecker, OM4
ECM-UM12-05-93T EDGE™ MTP® zu LC Duplex Modul, 12 F, 50 µm Multimode (OM3)
ECM-UM12-05-93TI EDGE™ Lösung Modul, 12 F, LC Duplex auf MTP® Stecker, OM3
ECM-UM12-18-89G EDGE™ Lösung Modul, 12 F, LC APC auf MTP® APC Stecker, OS2